-- Sunday, November 21, 2010
15:00-18:00
Registration
18:00~
Welcome Reception (Ballroom 1)
 

-- Monday, November 22, 2010
Room (2F)
Ballroom 2
Ballroom 3
Ballroom 4
--- Mara ---
Main Loby
09:00-09:05
Opening Ceremony (Ballroom 1)
09:05-09:45

Plenary 1 (Ballroom 1)
Joo-Tae Moon (Samsung Electronics, Korea)
09:45-10:30

Plenary 2 (Ballroom 1)
Hee Gook Lee (Siltron, Korea)
10:30-10:45
Coffee
10:45-12:00
AA
AB
AC
AD
  
12:00-13:30
Lunch Break
13:30-15:30
BA
BB
BC
BD
Poster Session 1
(13:30-17:45)
BP
BQ
BR
BS
BT
15:30-15:45
Coffee
15:45-17:45
CA
CB
CC
 

-- Tuesday, November 23, 2010
Room (2F)
Ballroom 2
Ballroom 3
Ballroom 4
--- Mara ---
Main Loby
09:05-09:45

Plenary 3 (Ballroom 1)
Sumio Iijima (Meijo University, Japan)
09:45-10:30

Plenary 4 (Ballroom 1)
Koki Takanashi (Tohoku University, Japan)
10:30-10:45
Coffee
10:45-12:00
DA
DB
DC
DD
  
12:00-13:30
Lunch Break
13:30-15:30
EA
EB
EC
ED
Poster Session 2
(13:30-17:45)
EP
EQ
ER
ES
ET
15:30-15:45
Coffee
15:45-17:45
FA
FB
FC
19:00~
Banquet ((Ballroom 1)
 

-- Wednesday, November 24, 2010
Room (2F)
Ballroom 2
Ballroom 3
Ballroom 4
--- Mara ---
Main Loby
09:00-10:30
GA
GB
GC
GD
Poster Session 3
(09:00-12:00)
GP
GQ
GR
GS
GT
10:30-10:45
Coffee
10:45-12:00
HA
HB
HC
HD
12:00-13:30
Lunch Break
13:30-15:30
IA
IB
IC
ID
Poster Session 4
(13:30-17:45)
IP
IQ
IR
IS
IT
15:30-15:45
Coffee
15:45-17:45
JA
JB
    
 
 
 

AA: Oxide Semiconductor 1
AB: Advanced Patterning Technology 1
AC: Novel Fuel-Cell and Battery Materials 1
AD: OLED Materials and Devices 1

BA: Oxide Semiconductor 2
BB: Advanced Patterning Technology 2
BC: Advanced Packaging and Interconnection 1
BD: OLED Materials and Devices 2

CA: Oxide Semiconductor 3
CB: Thermoelectric Materials 1
CC: Advanced Packaging and Interconnection 2

DA: Novel Fuel-Cell and Battery Materials 2
DB: Carbon Nano Materials 1
DC: Advanced Packaging and Interconnection 3
DD: Thermoelectric Materials 2

EA: Non-Volatile Memory Materials and Processes
EB: Carbon Nano Materials 2
EC: Advanced Packaging and Interconnection 4
ED: Thermoelectric Materials 3

FA: Oxide Semiconductor 4
FB: Carbon Nano Materials 3
FC: Advanced Packaging and Interconnection 5
FD: Nano Dot, Nano Wire and Nano Processes 1

GA: Devices and Materials for Energy Harvesting and Storage 1
GB: Nano Devices and Structures 1
GC: Photovoltaic Science and Engineering 1
GD: Materials and Processes for Highly Efficient LED 1

HA: Devices and Materials for Energy Harvesting and Storage 2
HB: Nano Devices and Structures 2
HC: Photovoltaic Science and Engineering 2
HD: Materials and Processes for Highly Efficient LED 2

IA: Materials and Devices of Flexible Displays and Printed Electronics 1
IB: Nano Dot, Nano Wire and Nano Processes 2
IC: Photovoltaic Science and Engineering 3
ID: Materials and Processes for Highly Efficient LED 3

JA: Materials and Devices of Flexible Displays and Printed Electronics 2
JB: Nano Dot, Nano Wire and Nano Processes 3
 
 
 

BP: Devices and Materials for Energy Harvesting and Storage 1
BQ: Novel Fuel-Cell and Battery Materials
BR: Photovoltaic Science and Engineering 1
BS: Nano Dot, Nano Wire and Nano Processes 1
BT: Materials and Devices of Flexible Displays and Printed Electronics 1

EP: Photovoltaic Science and Engineering 2
EQ: Thermoelectric Materials
ER: Advanced Patterning Technology
ES: Materials and Processes for Highly Efficient LED
ET: OLED Materials and Devices

GP: Nano Dot, Nano Wire and Nano Processes 2
GQ: Carbon Nano Materials
GR: Advanced Packaging and Interconnection 1
GS: Oxide Semiconductor 1
GT: Materials and Devices of Flexible Displays and Printed Electronics 2

IP: Devices and Materials for Energy Harvesting and Storage 2
IQ: Photovoltaic Science and Engineering 3
IR: Nano Devices and Structures
IS: Advanced Packaging and Interconnection 2
IT: Oxide Semiconductor 2